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Albert Liu
Undergraduate Student

A picture taken during the photolithography step of the fabrication of LEDs. The wafer was covered with S1813 photoresist, spun for 60 seconds at 3000 rpm, and soft-baked on a hot plate set to 90 °C for three minutes. The LED mask was aligned with holes to maximize the total number of contacts and is about to be exposed for 25 seconds.

tliu@caltech.edu

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