A dual beam FEI Nova™ 600 Nanolab was used to generate focused ion beam images of 250 nm diameter copper nanopillars. The nanopillars were fabricated by electroplating from an acid copper plating solution into a prescribed polymethylmethacrylate (PMMA) template. The PMMA template was patterned using a Leica EBPG5000+ electron beam lithography system operating at 100kV. A 30kV Ga+ ion was used in order to image the electroplated copper nanopillars and investigate their microstructure. The image contrast is generated by varying Ga+ ion beam penetration depths due to differing grain-to-beam alignments. The grain microstructure here was an unexpected result of electroplating at a low current density. All tools used to fabricate and characterized this sample were made available in the Kavli Nanoscience Institute at CalTech.